Scavenging – Non-contact Solder Removal – provides a safe and effective means to prepare rework sites for component replacement.
Automated temperature control and precise scavenging gap prevents risk of damage to pads and solder mask while leaving a consistent layer of residual solder for optimum solderability.
- Computer controlled process temperature
- Board conditioning
- Dynamic Height Control assures consistent scavenger gap regardless of board contour
- Automated motion provides constant speed for improved uniformity and greater protection from overheating
- Available on Summit and Micra models